View TD62651FG_4155045.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TD62650,651,652FG
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62650FG,TD62651FG,TD62652FG
5V POWER SUPPLY & SUPPLY MONITORING + COMMUNICATIONS IC
The TD62650FG series covers products developed for use in microcomputer systems applicable to automatic vending machines. They produce an output voltage of 5 V 0.5 V without need for adjustment, through their accurate reference voltage and amplifier circuit. The 5V section can reset the system by outputting reset signals at power-on, and also output a reset signal when the 5 V output voltage drops below the specified 92% (TD62650FG / 652FG) or 85% (TD62651FG) because of external disturbances or other problem. It also incorporates a watchdog timer for self-diagnosing the system. When the system malfunctions, the IC generates reset Weight: 0.63 g (typ.) pulses intermittently to prevent the system from running away. The interface section incorporates three serial ports corresponding to the typical 24-V 4800 bps system in microcomputers. The suffix (G) appended to the part number represents a Lead (Pb)-Free product.
FEATURES
Accurate output : 5V 0.25 V Output PNP Tr incorporated : Current capacity ; 300 mA (max) Power-on Reset timer incorporated Watchdog timer incorporated Small flat package sealing Difference 1
CHARACTERISTIC Reset Detecting Voltage TD62650 / 652FG 5V / 92% TD62651FG 5V / 85%
: SSOP30 pin (1 mm pitch)
PIN CONNECTION
Difference 2 Time setting resistance 22 k for power-on reset / watchdog timer, and PULL resistance of 4.7 k for RESET pin.
TD62650FG Built-in TD62651FG None TD62652FG None
1
2006-06-14
TD62650,651,652FG
TD62650FG BLOCK DIAGRAM
5V POWER SUPPLY + SUPPLY MONITORING
INTERFACE
2
2006-06-14
TD62650,651,652FG
TD62651FG / TD62652FG BLOCK DIAGRAM
5V POWER SUPPLY + SUPPLY MONITORING
INTERFACE
3
2006-06-14
TD62650,651,652FG
INTERFACE INPUT / OUTPUT CIRCUITS
4
2006-06-14
TD62650,651,652FG
PIN FUNCTION
PIN No. 1 2 3 4 GND COMP VCCIN VCCOUT PIN NAME PIN FUNCTION GND pin for 5 V power supply and supply monitoring. Phase compensation pin for output stabilization. Power supply pin for internal circuit. The output voltage can also be detected at this pin. Output pin for built-in Power Tr, having a current capacitance of 300 mA (max). It is also used as an output pin for 5 V constant power supply through shorting with VCCIN pin. Connected to the base of an external PNP transistor so that the output voltage is stabilized. Current design suitable for load capacities is thus possible. Since the recommended IOUT current is 5 mA, an output current of 300 mA is assured if the external transistor has an hFE of 60. When the internal transistor is used, it can be opened. Power supply starting pin. The starting current is supplied through a resistor to which the input voltage is applied. When VCCIN rises above 3.0 V, the starting current is absorbed in the internal circuit ; instead, IOUT is supplied via VCCIN. Power supply pin for the 24-V system. Input pin for the 24-V system interface. Pull-up resistor 47 k is incorporated at VCC2 pin. Input pin for 24-V system interface. Pull-up resistor 47 k is incorporated at VCC2 pin. Output pin for the 24-V system open collector. Input pin for the 5-V system Push / Pull inverter. Pull-up resistor 30 k is incorporated at VCCIN pin. LED lighting pin for the 8 system open collector. 680 limiting resistor is incorporated. Output pin for the 24-V system open collector. Input pin for the 24-V system interface. Pull-up resistor 47 k is incorporated at the VCC2 pin. GND pin for the 5-V / 24-V system interfaces. Output pin for the 5-V system open collector. Pull-up resistor 4.7 k is incorporated at the VCCIN pin. Output pin for the 5-V system Push-Pull buffer. Input pin for the 5-V system interface, for input at LED (12 pin) and TXD (13 pin) pins. Output pin for the 5-V system Push / Pull inverter (CPUOUT : 11 pin). Input pin for the 5-V system interface. Output pin for the 5-V system open collector. Pull-up resistor 4.7 k is incorporated at VCCIN pin. Output pin for the 5-V system Push / Pull buffer. Output pin for the 5-V system Push-Pull buffer. Output pin for the 5-V system open collector. Pull-up resistor 4.7 k incorporated at VCCIN pin. Output pin for the 5-V system Push-Pull buffer.
5
OUT
6
BIAS
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
VCC2 SLSYN 50 / 60 MSSYN CPUOUT LED TXD RXD PG SLTXD MSRXD MSTXD TXDOUT SYNIN MS50 / 60 SL50 / 60 SYN HNSYN CCK
5
2006-06-14
TD62650,651,652FG
PIN No. 26 27 28 CK MSCK TC PIN NAME PIN FUNCTION Input pin for watchdog timer. The pin is pulled up to VCCIN if the IC is used only as a power-on reset timer. To input clock pulses, one-shot pulses can be generated for CK (26 pin) inputs at the rise edge. When the pin is not used, short it with GND. Time setting pin for the reset and watchdog timers.
NPN transistor open-collector output. (1) The signal goes low when the output voltage drops below the specified 92% (TD62650 / 652) or 85% (651) level.
29
RESET
(2) The pin generates a reset signal that is determined by the external condenser connected to the TC pin. (3) The pin generates reset pulses intermittently if no clock is attached to the CK pin. This function can be used as a watchdog timer for microcomputers.
30
ADJ
Output voltage adjusting pin. The voltage will increase when a resistor is connected between ADJ and GND (1 pin). It can reduce the voltage when the resistor is inserted between ADJ and VCCIN (3 pin). The voltage can be changed by a maximum of 1V.
6
2006-06-14
TD62650,651,652FG
TIMING CHART (TD62650FG, TD62652FG)
Note:
TD6250FG incorporates RT (22k (Typ.) only for CT.)
TIMING CHART (TD62651FG)
7
2006-06-14
TD62650,651,652FG
ABSOLUTE MAXIMUM RATINGS (Ta = 25C)
CHARACTERISTIC SYMBOL VVCC24 VVCCIN VIN24 Input Voltage (Condition 1) (Condition 2) VIN5 VOUT24 VVCCOUT Output Voltage VLED (Condition 3) (Condition 4) VOUT5
IOUT IRESET Output Current IOUT Push / Pull IOUT5 IOUT24 IVCCOUT Power Dissipation Operating Temperature Storage Temperature PD (Note 5) Topr Tstg
RATING -0.4~35 -0.4~7 -0.4~VVCC2 + 0.4-0.4~30 -0.4~VVCCIN + 0.4 -0.4~VVCC2 + 0.4 -0.4~VBIAS + 0.4 -0.4~VBIAS + 0.4-0.4~10 -0.4~VVCCIN + 0.4
10 4 4 10 24 300 1.47 -40~85 -55~150
UNIT V V VCC2, BIAS VCCIN
PIN
V
SLSYN, 50 / 60, RXD
V V V
CPUOUT, MSCK, ADJ, COMP, CK, TC, SYNIN, MSTXD MSSYN, TXD VCCOUT, OUT
V
LED
V
mA mA mA / ch m / ch mA / ch mA W C C
RESET , CCK, HNSYN, SYN, SL50 / 60, MS50 / 60, TXDOUT, MSRXD, SLTXD OUT RESET CCK, SYN, SL50 / 60, TXDOUT, SLTXD HNSYN, MS50 / 60, LED, MSRXD MSSYN, TXD VCCOUT
Condition 1: VVCC2 29.6 V Condition 2: VVCC2 > 29.6 V Condition 3: VBIAS 9.6 V Condition 4: VBIAS > 9.6 V Note 5: Board mounting time (50 x 50 x 1.6 mm, Cu = 30%)
8
2006-06-14
TD62650,651,652FG
DC ELECTRICAL CHARACTERISTICS (Ta = 25C, VCCIN = 5 V)
Interface Section
CHARACTERISTIC SYMBOL VIH5 (Note 1) Input Voltage VIL5 VIH24 VIL24 IIH5-1 IIL5-1 IIH5-2 Input Current IIL5-2 IIH24 IIL24 VOH5-1 VOH5-2 VOL5-1 Output Voltage VOL5-2 VOL5-3 VOL LED VOL24 Output Impedance Current Consumption 24 Leakage Current Output Shorting Current ROL LED ROH5 IVCC2 ILEAK24 ILEAK5 IOS (Note) (Note 6) (Note 4) (Note 4) (Note 5) LED (Note 6) LED (Note 5) (Note 3) VIN = 5 V VIN = 0 V VIN = 5 V VIN = 0 V VIN = 24 V VIN = 0 V IOH = -20 A IOH = -4 mA IOL = 20 A IOL = 4 mA IIN = 500 A IOL = 10 mA IIN = 200 A IOL = 1 mA IIN = 200 A IOL = 24 mA (Note 8) (Note 9) VVCC2 = 24 V VOH = 24.0 V VOH = 5 V VCCIN = 5.25 V VOH = 0 V (Note 1) PIN TEST CIR- TEST CONDITION CUIT MIN VCCIN x 70% 13 -0.4 320 480 115 1.1 350 VCC - 0.1 VCCIN x 70% 540 3.2 TYP. 462 0 690 170 1.6 510 680 4.7 1.6 17.5 MAX VCCIN x 30% VCC2 + 0.4 7 600 10 940 240 2.1 690 0.1 VCCIN x 30% 0.5 1.4 0.5 1000 6.2 2.1 10 10 k mA A mA V mA / ch A A A / ch UNIT
V
(Note 7)
(Note 2)
(Note 4)
Note: Note 1: Note 2: Note 3: Note 4:
Two outputs or more must not be shorted at the same time. Shorting duration must be limited to less than 1 second. CPUOUT, SYNIN, MSTXD Note 5: HNSYN, MS50 / 60, MSRXD SLSYN, 50 / 60, RXD Note 6: MSSYN, TXD SYNIN, MSTXD Note 7: CPUOUT CCK, SYN, SL50 / 60, TXDOUT, SLTXD Note 8: (VOL (@IOL = 5 mA) - VOL (@IOL = 1 mA)) / 4 mA Note 9: 4 V / (@IOH (VOH = 0 V) - @IOH (VOH = 4 V))
9
2006-06-14
TD62650,651,652FG
(Unless otherwise specified, VBIAS = 7 to 17 V, Ta = -40 to 85C) 5V power supply, supply monitoring section
CHARACTERISTIC Output Voltage Input Stability Load Stability Temperature Coefficient Output Voltage Output Leakage Current Input Current SYMBOL VCCOUT VCCOUT LINE VCCOUT LOAD VCCOUT t VOL RESET ILEAK RESET ITC VTC H Threshold Voltage VTC L Input Current ICK VIH Input Voltage VIL TD62650 / 652FG Reset Detecting Voltage VCC RESET TD62651FG ROH RESET ROH TC Current Consumption 5 Bias Current Consumption IVCCIN IBIAS VBIAS = 8V TD62650FG Watchdog Timer TWD TD62651 /652FG TD62650FG Reset Timer (1) (Note 3) TRST (1) TD62651 / 652FG Reset Timer (Note 3) TRST (2) (Note 6) (Note 6) TD62650FG TD62650FG (Note 1) (Note 1) (Note 2) (Note 5) (Note 7) (Note 6) (Note 4) RESET "Low" to "High" VIN = 5 V (Note 8) VCCIN x 70% 89% x VCCIN 82% x VCCIN 3.2 15 15.4 x CT 0.9 x CTRT 24.2 x CT 1.3 x CTRT 300 x CT TEST CIR- CUIT IOL = 2 mA VRESET = 7 V VTC = 0 to 3.5 V (Note 8) TEST CONDITION IVCCOUT = 0.1 A VBIAS = 7~35 V IVCCOUT = 1~150 mA MIN 4.75 -3 TYP. 5.0 0.1 0.1 0.01 80% x VCCIN 40% x VCCIN 0.3 92% x VCCIN 85% x VCCIN 4.7 22 5 11.5 1.73 24.2 x CT 1.1 x CTRT 35.2 x CT 1.6 x CTRT 600 x CT MAX 5.25 0.5 0.5 0.5 5 3 V 0.7 VCCIN x 30% 95% x VCCIN 88% x VCCIN 6.2 29 6.5 15.0 2.25 33.0 x CT 1.3 x CTRT 48.4 x CT 1.9 x CTRT 900 x CT mA mA ms s ms s ms V mA UNIT V % % % / C V A A
DC ELECTRICAL CHARACTERISTICS
RESET "High" to "Low"
V
Output Impedance
k
10
2006-06-14
TD62650,651,652FG
CHARACTERISTIC Clock Input Pulse width Maximum Response Frequency 1 Maximum Response Frequency 2 Msck Pin Input Signal Rise Time Minimum Input / Output Voltage Difference SYMBOL TW CK fMAX MSCK fMAX CK tr MSCK VOH VCCOUT TEST CIR- CUIT IVCCOUT = 0.1 A (Note 9) TEST CONDITION MIN 3 2 10 TYP. MAX 500 1.5 UNIT s kHz kHz ns V
Note 1: 4 V / (@IOH (VOH = 0 V) - @IOH (VOH = 4 V) Note 2: VBIAS = 8 V, VCCIN - VCCOUT Short Open Collector I / O : Open Push-Pull I / O : Open MSCK Input : Open Note 3: Reset Timer (1) : Power On Reset Time Reset Timer (2) : Watchdog Reset Time Note 4: MSCK, CK Pins Note 5: HNSYN, MS50 / 60, MSRXD Pull / UP Resistance + CCK, SYN, SL50 / 60, TXDOUT, SLTXD Driving Current Note 6: CT Unit (F) Note 7: VCCIN, VCCOUT Open Note 8: Only TD62651FG, TD62652FG Note 9: Input Condition 5 V : 0 to 100%
11
2006-06-14
TD62650,651,652FG
AC ELECTRICAL CHARACTERISTICS (Ta = 25C)
CHARACTERISTIC CHARACTERISTIC / INPUT CONDITION SLSYN-CCK (Note 1) SLSYN-SYN (Note 1) SLSYN-HNSYN (Note 1) 50 / 60-MS50 / 60 (Note 1) 50 / 60-SL50 / 60 (Note 1) Propagation Delay Time (tpLH: 50%-50%, tpHL: 50%-50%) SYNIN-MSSYN (Note 2) CPUOUT-TXDOUT (Note 2) MSTXD-LED (Note 2) MSTXD-TXD (Note 2) RXD-SLTXD (Note 1) RXD-MSRXD (Note 1) MS50 / 60 SL50 / 60 LED MSSYN TXDOUT Rise Time (tr: 10%-90%) TXD SYN CCK HNSYN SLTXD MSRXD SYMBOL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL tpLH tpHL TEST CIR- CUIT OUTPUT CONDITION (Note 4) MIN TYP. 0.6 1.5 0.6 1.5 0.5 0.1 0.5 0.1 0.6 1.5 1.0 0.1 1.0 1.2 0.5 0.1 1.0 0.1 0.6 1.5 0.5 0.1 0.3 0.2 0.2 1.1 0.2 1.1 0.2 0.2 0.3 0.2 0.3 MAX s s UNIT
(Note 4)
(Note 5)
(Note 5)
(Note 4)
(Note 3)
(Note 4)
(Note 5)
(Note 3)
(Note 4)
(Note 5)
tr

12
2006-06-14
TD62650,651,652FG
CHARACTERISTIC CHARACTERISTIC / INPUT CONDITION MS50 / 60 SL50 / 60 LED MSSYN Fall Time (tr: 90%-10%) TXDOUT TXD SYN CCK HNSYN SLTXD MSRXD SYMBOL TEST CIR- CUIT TEST CONDITION MIN TYP. 0.1 0.5 0.1 0.1 0.5 0.1 0.5 0.5 0.1 0.5 0.1 MAX s UNIT
tf

Input / Output Conditions Input Condition Note 1: 24-V System : 0.2s at 2 to 22-V Note 2: 5-V System : 0.1s at 30 to 70% Output Conditions Note 3: 24-V System : CL = 50 pF Note 4: 5-V System : CL = 50 pF RL = 5 k Note 5: 5-V System : CL = 50 pF
13
2006-06-14
TD62650,651,652FG
APPLICATION CIRCUIT
When using an external PNP transistor :
Note 1: When using the MSCK pin, short circuit the CK pin with GND. When using the CK pin, short circuit the MSCK pin with GND. Note 2: C1 and C2 are necessary to absorb external noise, etc. Connect them as close to the IC as possible. C3 is used for phase correction, but this also must be connected as close to the IC as possible. We recommend that C4 be connected between OUT and VCCIN.
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC (VCCIN, VCCOUT, BIAS, VCC2) and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
14
2006-06-14
TD62650,651,652FG
When using a built-in PNP transistor :
Note 1: When using the MSCK pin, short the CK pin with GND. When using the CK pin, short the MSCK pin with GND. Note 2: C1 and C2 are necessary to absorb external noise, etc. Connect them as close to the IC as possible. C3 is used for phase correction, but this also must be connected as close to the IC as possible.
15
2006-06-14
TD62650,651,652FG
PACKAGE DIMENSIONS
SSOP30-P-375-1.00 Unit: mm
Weight: 0.63 g (Typ.)
16
2006-06-14
TD62650,651,652FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
(2)
(3)
(4)
(5)
17
2006-06-14
TD62650,651,652FG
Points to Remember on Handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
18
2006-06-14
TD62650,651,652FG
About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
19
2006-06-14

▲Up To Search▲

Price & Availability of TD62651FG

	To Download TD62651FG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .